Title:
研磨装置
Document Type and Number:
Japanese Patent JP7351871
Kind Code:
B2
Abstract:
To provide a device that can move a polishing table and a work-piece relatively, with a central pressing part pressing a polishing surface against a rotation center part of a surface to be polished.SOLUTION: A polishing device comprises a work-piece holding part, a pressing body 46, a tape feeding mechanism 40 and a moving mechanism. A portion pressed against a surface 302 to be polished of a work-piece 300 by the pressing body 46, of a polishing surface 204 of a polishing tape 200 contacts the whole of the surface 302 to be polished, while the work-piece 300 rotates around a rotating axis line Ax once. A pressing surface 80 of the pressing body 46, which contacts the polishing tape 200, is provided with a center pressing part for pressing the polishing surface 204 against the rotation center part of the surface 302 to be polished and a notch part 86 formed at a portion made adjacent, in the opposite direction of the tape feeding direction, to the center pressing part.SELECTED DRAWING: Figure 2
Inventors:
Toshikazu Semba
Satsuki Onna Haruyuki
Youya Tobe
Satsuki Onna Haruyuki
Youya Tobe
Application Number:
JP2021078521A
Publication Date:
September 27, 2023
Filing Date:
May 06, 2021
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B24B21/08; B24B21/00
Domestic Patent References:
| JP3234459A | ||||
| JP2541538Y2 | ||||
| JP7100294B2 |
Attorney, Agent or Firm:
Takehiro Chiba
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi
Toshiyuki Miyadera
Takayuki Chima
Yasuharu Nakasone
Shiro Sakai
Tosuke Sekiguchi
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