Title:
研磨パッド、研磨方法ならびに半導体デバイスの製造方法および半導体デバイス
Document Type and Number:
Japanese Patent JP4806160
Kind Code:
B2
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Inventors:
Takatoshi Yamada
Masahiko Nakamori
Tetsuo Shimomura
Kazuyuki Ogawa
Atsushi Kazuno
Yoshiyuki Nakai
Masahiko Nakamori
Tetsuo Shimomura
Kazuyuki Ogawa
Atsushi Kazuno
Yoshiyuki Nakai
Application Number:
JP2003423248A
Publication Date:
November 02, 2011
Filing Date:
December 19, 2003
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO.,LTD.
International Classes:
H01L21/304; B24B37/20; B24B37/24; B24B37/26
Domestic Patent References:
| JP10337651A | ||||
| JP11320390A | ||||
| JP2000117620A | ||||
| JP2003225855A | ||||
| JP2002280335A | ||||
| JP2647046B2 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Takuji Yamada
Muneo Yamamoto
Yuko Goto
Takuji Yamada
Muneo Yamamoto
Yuko Goto