Title:
研磨パッド
Document Type and Number:
Japanese Patent JP7118841
Kind Code:
B2
Abstract:
To provide a polishing pad that reduces defects occurring at an initial period of polishing while shortening a time necessary for breaking-in.SOLUTION: A polishing pad comprises a polishing layer for polishing a work piece. In the polishing pad, an arithmetic average height (Sa) representing an average of absolute values of differences between heights of respective points is 3 to 10 (μm) relative to an average surface of a polishing surface of the polishing layer and an arithmetic average curvature (Spc) of peak points representing an average of principal curvatures of peak points of the polishing surface is 200 to 600 (1/mm).SELECTED DRAWING: None
Inventors:
Tatsuma Matsuoka
Hiro Kurihara
Satsuki Narushima
Hiro Kurihara
Satsuki Narushima
Application Number:
JP2018183768A
Publication Date:
August 16, 2022
Filing Date:
September 28, 2018
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/26; C08G18/08; H01L21/304
Domestic Patent References:
| JP2004260070A | ||||
| JP2015199144A |
Attorney, Agent or Firm:
Youichiro Uemura