Title:
研磨パッド
Document Type and Number:
Japanese Patent JP7189057
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a polishing pad. The polishing pad has a polishing layer of which a temperature change of a value of tan[delta] is small and polishing performance is less susceptible to influence of temperature. The polishing pad is characterized in having a polishing layer containing polyurethane resin foam. The polyurethane resin is a cured product of a curable resin composition containing an isocyanate-terminated urethane pre-polymer and a curing agent. The isocyanate-terminated pre-polymer contains components derived from toluene diisocyanate (TDI) and polypropylene glycol (PPG). The value of tan[delta] of the polishing layer is 0.12 or more at 40 DEG C as measured by the dynamic viscoelasticity test at a measurement frequency of 10 radians/sec and the tensile mode and calculated by the following formula: [(maximum value of tan[delta] of the polishing layer at 20 DEG C to 80 DEG C) - (minimum value of tan[delta] of the polishing layer at 20 DEG C to 80 DEG C)] / tan[delta] of the polishing layer at 40 DEG C, wherein the fluctuation rate of tan[delta] of the polishing layer at 20 DEG C to 80 DEG C is 50% or less.
Inventors:
Tatsuma Matsuoka
Hiro Kurihara
Satsuki Narushima
Hiro Kurihara
Satsuki Narushima
Application Number:
JP2019058669A
Publication Date:
December 13, 2022
Filing Date:
March 26, 2019
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; C08G18/00; C08G18/10; C08G18/48; C08G18/66; C08J9/32; H01L21/304
Domestic Patent References:
| JP2018127562A |
Attorney, Agent or Firm:
Osamu Yamamoto
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda
Toru Miyamae
Motoharu Nakanishi
Toyoji Matsuda