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Patent Searching and Data


Title:
ポリプロピレン系樹脂組成物及び成形体
Document Type and Number:
Japanese Patent JP5651918
Kind Code:
B2
Abstract:
Provided are a polypropylene resin composition which produces only a little mold staining at the time of molding, which is excellent in the stability against light and the molding processability, which has good balance between high rigidity and impact resistance, and which can give a molded article excellent in flow mark appearance and weld appearance when being processed into a molded article, and a molded article produced therefrom. The polypropylene resin composition of the present invention contains 99 to 60 parts by weight of propylene-based polymer (A), 1 to 40 parts by weight of inorganic filler (B) having an average particle diameter of 0.01 to 100 mum, and 0.05 to 5 parts by weight, per 100 parts by weight of the resin composition (I), of an hindered amine-type light stabilizer (C) which satisfies the specified requirements (a), (b) and (c), provided that the combined amount of the propylene-based polymer (A) and the inorganic filler (B) is 100 parts by weight.

Inventors:
丸山 剛志
渡辺 毅
大林 義明
Application Number:
JP2008323468A
Publication Date:
January 14, 2015
Filing Date:
December 19, 2008
Export Citation:
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Assignee:
住友化学株式会社
International Classes:
C08L23/10; C08F222/40; C08K3/00; C08K5/3432; C08L23/08; C08L35/00
Attorney, Agent or Firm:
Nakayama 亨
Toru Sakamoto