Title:
A polypropylene regin foaming particle, its process, and a polypropylene regin foaming particle fabrication object
Document Type and Number:
Japanese Patent JP5997181
Kind Code:
B2
Abstract:
An electrostatic dissipative, polypropylene-based resin expanded bead containing electrically conductive carbon black, having an apparent density of 10 to 120 kg/m 3 and formed of a base resin which includes a polypropylene resin forming a continuous phase, and a polyethylene resin forming dispersed phases dispersed in the continuous phase, with the carbon black being unevenly distributed to the dispersed phases side. The polyethylene resin is an ethylene homopolymer or a copolymer of ethylene and C 4 to C 6 ±-olefinand a weight ratio of the polypropylene resin to the polyethylene resin is 99.5:0.5 to 65:35. A molded article obtained by in-mold molding of such expanded beads exhibits electrostatic dissipative properties with a surface resistivity in the range of 1×10 5 to 1×10 10 © in a stable manner.
Inventors:
Takuya Chiba
Masaharu Oikawa
Shinohara Mitsuru
Masaharu Oikawa
Shinohara Mitsuru
Application Number:
JP2013551563A
Publication Date:
September 28, 2016
Filing Date:
December 06, 2012
Export Citation:
Assignee:
JSP Corporation
International Classes:
C08J9/18; C08K3/04; C08L23/04; C08L23/10
Domestic Patent References:
| JP2005023302A | ||||
| JP2000169619A | ||||
| JP2004083804A |
Attorney, Agent or Firm:
Kuninori Hirosawa
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