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Title:
A porous material and a honeycomb structural body
Document Type and Number:
Japanese Patent JP6006782
Kind Code:
B2
Abstract:
There are disclosed a porous material having a high thermal shock resistance and a honeycomb structure. The porous material contains main aggregates and auxiliary aggregates as aggregates, the main aggregates are silicon carbide particles, the auxiliary aggregates are at least either of mullite particles or alumina particles, the aggregates are bound to one another via a binding phase, so as to form pores, and the binding phase is at least one of an amorphous phase and a cordierite phase, and a porosity is from 40 to 90%. Furthermore, the honeycomb structure is constituted of such a porous material, and includes partition walls defining and forming a plurality of cells extending from one end face to the other end face.

Inventors:
Yui Izumi
Yoshimasa Kobayashi
Application Number:
JP2014507990A
Publication Date:
October 12, 2016
Filing Date:
March 27, 2013
Export Citation:
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Assignee:
Nippon Insulator Co., Ltd.
International Classes:
C04B38/06; B01D39/20; B01J27/224; B01J32/00; C04B35/565; C04B35/626
Domestic Patent References:
JP4227347B2
JP2003176185A
Attorney, Agent or Firm:
Ippei Watanabe
Shigeru Koike