A position sensing device, a manufacturing method for the same, and a scale member

Title:

A position sensing device, a manufacturing method for the same, and a scale member

Document Type and Number:

Japanese Patent JP6216227

Kind Code:

B2

Inventors:

Ohno Mitsuru
Akira Kimura
Kitamura Katsumi

Application Number:

JP2013234651A

Publication Date:

October 18, 2017

Filing Date:

November 13, 2013

Export Citation:

Assignee:

dmg Mori Seiki Co., Ltd.

International Classes:

G01D5/245

Domestic Patent References:

JP3010090U

Foreign References:

EP2642252A1

Attorney, Agent or Firm:

Kato Takushi

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