Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3194045
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To adjust the thickness of a sealing film, between columnar electrodes of a semiconductor device, in its early stages.
SOLUTION: The sealing film 16 is formed with a print mask and a squeegee 15. In this case, the tip of the squeegee 15 has a flank almost in a V-shape and is pressed in between columnar electrodes 12 for printing. Then the sealing film 16 is recessed between the columnar electrodes 12. In this case, the thickness of the sealing film 16 is directly proportional to the weight of liquid sealing resin printed on a silicon substrate 11. The print quantity (weight) of the liquid sealing resin printed on the silicon substrate 11, is in inversely proportional to the intrusion quantity of the squeegee 15 (how much the tip part of the squeegee 15 is pressed inbetwen the columnar electrodes 12 from the top surface of the columnar electrodes 12). For the purpose, the press-in quantity of the squeegee 15 is adjusted to suppress the weight of the liquid sealing resin printed on the silicon substrate 11, and consequently the thickness of the sealing film 16 can be controlled.
Inventors:
Osamu Kuwahara
Application Number:
JP26092599A
Publication Date:
July 30, 2001
Filing Date:
September 14, 1999
Export Citation:
Assignee:
CASIO COMPUTER CO.,LTD.
International Classes:
H01L23/12; H01L21/60; (IPC1-7): H01L23/12; H01L21/60
Attorney, Agent or Firm:
Hanawa Yoshio