Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POSITIVE RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, PHOTOREACTIVE QUENCHER, AND POLYMER COMPOUND
Document Type and Number:
Japanese Patent JP2017015777
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a positive resist composition, a resist pattern forming method, an acid diffusion control agent, and a polymer compound.SOLUTION: A positive resist composition, which generates an acid upon exposure and whose solubility in an alkali developer increases by the action of an acid, contains: a base component (A) whose solubility in an alkali developer increases by the action of an acid; and a compound (m) represented by a general formula (m0) [where Zto Zare each an electron-withdrawing substituent; Rband Rbare each an alkyl group, an optionally substituted alicyclic hydrocarbon group or a hydroxyl group; Rbis an optionally substituted aryl, alkyl or alkenyl group; n1 and n2 are each an integer of 0-3; and X0is an organic anion].SELECTED DRAWING: None

Inventors:
YAMAZAKI HIROTO
KOMURO YOSHITAKA
ARAI MASATOSHI
KAWANA DAISUKE
SUZUKI KENTA
FUJII TATSUYA
Application Number:
JP2015129169A
Publication Date:
January 19, 2017
Filing Date:
June 26, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/004; C07C381/12; C08F220/10; G03F7/039
Domestic Patent References:
JP2014002359A2014-01-09
JP2014235248A2014-12-15
JP2014234348A2014-12-15
JP2012107151A2012-06-07
JP2005062800A2005-03-10
JP2006241435A2006-09-14
JP2017008014A2017-01-12
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida