Title:
A positive type radiation-sensitive constituent, a hardening film, and a formation method for the same
Document Type and Number:
Japanese Patent JP5917150
Kind Code:
B2
Abstract:
Disclosed is a polysiloxane positive radiation-sensitive composition that has sufficient radiation sensitivity and excellent melt-flow resistance in a heating step after developing, and that is used favorably in forming: a cured film having excellent heat resistance, transparency, solvent resistance, and low dielectric properties; and a liquid crystal cell having a high voltage holding ratio. Further disclosed are the cured film formed from the composition, and a method for forming the cured film. The positive radiation-sensitive composition contains [A] a siloxane polymer, [B] a quinone diazide compound, and [C] a radiation-sensitive acid generator having a wavelength of maximum absorption that is shorter than the wavelength of maximum absorption of [B] the quinone diazide compound.
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Inventors:
Hanamura Masaaki
Daigo Ichinohe
Daigo Ichinohe
Application Number:
JP2011543199A
Publication Date:
May 11, 2016
Filing Date:
November 08, 2010
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
G03F7/023; G03F7/004; G03F7/075; G03F7/40; H01L21/027
Domestic Patent References:
| JP2008116785A | 2008-05-22 | |||
| JP2009169343A | 2009-07-30 | |||
| JP2009075326A | 2009-04-09 |
Attorney, Agent or Firm:
Hajime Amano