Title:
A potting method of high-voltage part potting structure and a high-voltage part
Document Type and Number:
Japanese Patent JP6044109
Kind Code:
B2
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Inventors:
Takuya Sato
Hideyasu Ishihara
Hideyasu Ishihara
Application Number:
JP2012107795A
Publication Date:
December 14, 2016
Filing Date:
May 09, 2012
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01F27/32; H01F30/10; H01F37/00; H01F41/12
Domestic Patent References:
JP62176196A | ||||
JP59119814A | ||||
JP9260158A | ||||
JP60126893A | ||||
JP57088625A | ||||
JP52147703A | ||||
JP2004248426A |
Attorney, Agent or Firm:
Tadahiko Inaba
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
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