Title:
パワーエレクトロニクスユニット
Document Type and Number:
Japanese Patent JP7282109
Kind Code:
B2
Abstract:
A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.
More Like This:
| WO/2023/094663 | ELECTRONICS MODULE |
| JPH04230065 | COOLING STRUCTURE |
| JPH05343577 | CONNECTOR CONNECTING STRUCTURE FOR COOLER |
Inventors:
Egger Sebastian
Ganz Matthias
Horvat Janko
Kuruni Class
Sever Peter
Ganz Matthias
Horvat Janko
Kuruni Class
Sever Peter
Application Number:
JP2020573312A
Publication Date:
May 26, 2023
Filing Date:
May 24, 2019
Export Citation:
Assignee:
MAHLE International GmbH
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| JP2000514252A | ||||
| JP2006310363A | ||||
| JP2013247354A | ||||
| JP6104358A |
Foreign References:
| US20090032937 | ||||
| US20050143000 | ||||
| US20100033932 |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office
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