Title:
給電装置
Document Type and Number:
Japanese Patent JP7276173
Kind Code:
B2
Abstract:
To reduce the size of a device.SOLUTION: A power supply device 10 comprises a case 20, a substrate 81 installed in the case 20, an input unit 89 attached to the substrate 81, an output unit 90 attached to the substrate 81, a plate spring 91, and a cover 110. The case 20 includes a hanging hole forming surface 62. The hanging hole forming surface 62 forms a hanging hole 63. The plate spring 91 includes a claw portion 94 and an elastic deformation portion 95. The claw portion 94 is inserted into the hanging hole 63. The claw portion 94 is hung on the hanging hole forming surface 62. The elastic deformation portion 95 is in contact with the substrate 81.SELECTED DRAWING: Figure 3
Inventors:
Yusuke Yamamoto
Jin Shimitsu
Jin Shimitsu
Application Number:
JP2020009162A
Publication Date:
May 18, 2023
Filing Date:
January 23, 2020
Export Citation:
Assignee:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
International Classes:
H02M3/00; H05K5/02; H05K5/04; H05K7/14
Domestic Patent References:
| JP3218109U | ||||
| JP2018064056A | ||||
| JP2013247091A |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda
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