Title:
A printed circuit board provided with shape parts, and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5905571
Kind Code:
B2
Abstract:
A printed circuit board and a method for the production thereof. The printed circuit board can include a shaped part made of an electrically conducting material and can be used to manage the currents and heat volumes that occur in the field of power electronics.
Inventors:
Welfel, marcus
Application Number:
JP2014511771A
Publication Date:
April 20, 2016
Filing Date:
May 23, 2012
Export Citation:
Assignee:
Yuma Tech Game Beher
International Classes:
H05K3/20; H01F17/00; H01F17/04; H05K1/02; H05K1/16; H05K3/46
Domestic Patent References:
| JP20084823A | ||||
| JP548379U | ||||
| JP2007158341A |
Attorney, Agent or Firm:
Moriaki Ogawa
Shoichi Okuyama
Haruyuki Nishiyama
Rie Ikemoto
Mitsuji Sekiya
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Shoichi Okuyama
Haruyuki Nishiyama
Rie Ikemoto
Mitsuji Sekiya
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura