Title:
多平面アンテナをもつプリント回路基板およびその構成方法
Document Type and Number:
Japanese Patent JP5006447
Kind Code:
B2
Abstract:
Multi-plane antennae on a substrate having a front face and a back face are provided. A plurality of through holes extend through the substrate between the front face and the back face of the substrate. A first antenna component is on the front face of the substrate and a second antenna component is on the back face of the substrate. A conductive via extends through a selected one of the through holes that electrically connects the first antenna component and the second antenna component to define the multi-plane antenna on the substrate. The substrate may be a printed circuit board (PCB). Mobile terminals including a multi-plane antenna and methods of configuring a multi-plane antenna are also provided.
Inventors:
Thora, shulsi
Ozker, Mete
Ozker, Mete
Application Number:
JP2010518165A
Publication Date:
August 22, 2012
Filing Date:
February 04, 2008
Export Citation:
Assignee:
Sony Mobile Communications, AB
International Classes:
H01Q1/38; H01Q9/16; H01Q9/30; H01Q11/08; H01Q13/08; H05K1/16; H05K3/46
Domestic Patent References:
| JP2006005406A | ||||
| JP2002314324A | ||||
| JP2003188509A |
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura