Title:
熱硬化性オリゴマーまたはポリマー、これを含む熱硬化性樹脂組成物およびこれを用いたプリント配線板
Document Type and Number:
Japanese Patent JP5657871
Kind Code:
B2
Abstract:
A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.
Inventors:
李 在 俊
金 萬 鍾
金 光 熙
王 泰 俊
金 萬 鍾
金 光 熙
王 泰 俊
Application Number:
JP2009180926A
Publication Date:
January 21, 2015
Filing Date:
August 03, 2009
Export Citation:
Assignee:
サムソン エレクトロ−メカニックス カンパニーリミテッド．
International Classes:
C08G85/00; C08G69/44; C08K3/22; C08L101/02; H05K1/03
Attorney, Agent or Firm:
Hatta international patent business corporation