PRINTING EQUIPMENT AND SOLDER MANAGEMENT SYSTEM

Japanese Patent JP2017213792

A

PROBLEM TO BE SOLVED: To provide printing equipment and a solder management system each of which can prevent the occurrence of a defective substrate by more correctly managing solder.SOLUTION: The printing equipment comprises: a storage unit which stores the allowable period during which use of solder supplied to a screen mask can be allowed; a period measurement unit which measures the period during which the solder is supplied to the screen mask; a determination unit which determines whether or not the solder supplied to the screen mask exceeds the allowable period on the basis of the period measured by the period measurement unit; and a notification unit which, when the determination unit determines that the solder supplied to the screen mask exceeds the allowable period, notifies a worker that the period of solder supply exceeds the allowable period. The period measurement unit measures the period in such a manner that the measurement interval of the period of movement of the solder on the screen mask by a squeegee is weighted to become larger than the measurement interval of the period of no movement of the solder on the screen mask.SELECTED DRAWING: Figure 15

NAKAMURA YUJI

JP2016109771A

December 07, 2017

June 01, 2016

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PANASONIC IP MAN CORP

B41F15/40; B41F33/02; H05K3/34

JP5292163B2	2013-09-18
JPH0832280A	1996-02-02
JP2011201203A	2011-10-13
JP2015039877A	2015-03-02
JP2000141600A	2000-05-23

US20150283637A1

2015-10-08

Kenji Kamada
Hiroo Maeda

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