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Patent Searching and Data


Title:
LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JPH0774394
Kind Code:
A
Abstract:

PURPOSE: To suppress the quantity of light which escapes to the part directly above an LED chip when the LED chip emits light by connecting a bump electrode provided at a wiring layer to LED light emitting bodies via a diffusion layer laid out so that the LED light emitting bodies are screened.

CONSTITUTION: A sheet or a plate containing a light diffusion material with a through hole 13a at a part corresponding to an LED chip 12 is applied to a wiring substrate 11 so that the LED chip 12 is stored within the through hole 13a and a diffusion layer 13 is provided. A light transmission wiring layer 14 such as a transparent or semi-transparent sheet where a bump electrode consisting of silver, etc., and wiring are formed at a part corresponding to the LED chip 12 is contact-bonded to a terminal where a bump electrode 15 at the wiring layer 14 is provided on the upper surface of the LED chip 12 from the upper part of the wiring substrate 11 where the LED chip 12 and the diffusion layer 13 are provided, thus suppressing light escaping to a part directly above the LED emission by the LED light emitting body and the bump electrode of the light transmission wiring layer provided on it.


Inventors:
SAWABE TSUTOMU
Application Number:
JP21997793A
Publication Date:
March 17, 1995
Filing Date:
September 03, 1993
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01L33/36; H01L33/62; (IPC1-7): H01L33/00