Title:
A probe card and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6092729
Kind Code:
B2
Abstract:
A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair.
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Inventors:
Ryo Fukasawa
Michio Horiuchi
Tokutake Yasue
Yuichi Matsuda
Mitsuhiro Aizawa
Michio Horiuchi
Tokutake Yasue
Yuichi Matsuda
Mitsuhiro Aizawa
Application Number:
JP2013150337A
Publication Date:
March 08, 2017
Filing Date:
July 19, 2013
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
G01R1/073
Domestic Patent References:
| JP10019931A | ||||
| JP9229963A | ||||
| JP2005077322A | ||||
| JP59154054A | ||||
| JP2007329491A | ||||
| JP2005172603A | ||||
| JP2009538428A |
Foreign References:
| US6791344 | ||||
| US7271606 | ||||
| US5785538 |
Attorney, Agent or Firm:
Keizo Okamoto