Title:
プローブ
Document Type and Number:
Japanese Patent JP6380549
Kind Code:
B2
Abstract:
A probe that enables a circuit board for electronic components, which is a measurement subject, to be disposed more densely. The probe is capable of simultaneously measuring a plurality of locations. The probe includes a plurality of main body portions having central conductors that make contact with connectors, and a first member that binds the plurality of main body portions together. A recess portion, having a base surface from which tip ends of the plurality of central conductors project, is provided in the first member. The recess portion has a sloped surface that flares outward from a base portion of the recess portion toward an opening in the recess portion.
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Inventors:
Takai Yui
Application Number:
JP2016557501A
Publication Date:
August 29, 2018
Filing Date:
October 06, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G01R1/073; G01R1/067
Domestic Patent References:
| JP613473U | ||||
| JP61107166U | ||||
| JP200550720A |
Foreign References:
| EP2144338A1 |
Attorney, Agent or Firm:
Ascend Patent Business Corporation