Title:
プローバ及びウエハチャック温度測定方法
Document Type and Number:
Japanese Patent JP6425027
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a prober capable of measuring the upper surface temperature of a wafer chuck, under the substantially same environment as the actual inspection environment.SOLUTION: A prober includes a probe card temperature sensor 68 which is exchanged with a probe card. The probe card temperature sensor 68 includes a probe card type card body of the same or substantially the same shape as the probe card, and a plurality of pin type temperature sensors 68b provided in the card body, and measuring the temperature of the wafer chuck 18 by abutting against the upper surface thereof. A probe card holding mechanism holds the probe card temperature sensor 68 after exchange at the same or substantially the same position as that of the probe card before exchange, in the same or substantially the same posture.SELECTED DRAWING: Figure 16
Inventors:
Tomoya Nishida
Application Number:
JP2015060931A
Publication Date:
November 21, 2018
Filing Date:
March 24, 2015
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
H01L21/66; G01K1/14; G01K7/16
Domestic Patent References:
| JP2003273176A | ||||
| JP774218A | ||||
| JP62263647A | ||||
| JP2005337750A | ||||
| JP2014150168A | ||||
| JP2003197711A | ||||
| JP5297064A |
Attorney, Agent or Firm:
Kenzo Matsuura
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