Title:
プローバ
Document Type and Number:
Japanese Patent JP7245984
Kind Code:
B2
Abstract:
Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo frame attached to a head stage. A wafer chuck is moved toward a probe card while being fixed to a Z-axis movement-rotation unit in a detachable manner, and the wafer chuck is drawn toward the probe card by reducing pressure in an air-tight space formed between the wafer chuck and the probe card using a pressure reducing unit. Then, an electrical inspection of a wafer is performed while the test head, the pogo frame, the probe card, and the wafer chuck are integrated with respect to the head stage.
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Inventors:
Takuro Tanabe
Application Number:
JP2022014573A
Publication Date:
March 27, 2023
Filing Date:
February 02, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
G01R31/26; H01L21/66
Domestic Patent References:
| JP2014179379A | ||||
| JP201475420A | ||||
| JP2014150168A | ||||
| JP8264603A | ||||
| JP2008128838A |
Attorney, Agent or Firm:
Kenzo Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura
Kazuki Ohara
Kiyoshi Matsumura
Constitutional Matsuura