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Title:
Mold manufacturing method
Document Type and Number:
Japanese Patent JP6358869
Kind Code:
B2
More Like This:
JPS55122647HARDENING BINDING AGENT AT NORMAL TEMPERATURE OF GRANULAR BODY
WO/2020/035923BINDING AGENT COMPOSITION FOR FOUNDRY MOLDING
Inventors:
Takuya Ikeda
Yuichiro Tanaka
Application Number:
JP2014125395A
Publication Date:
July 18, 2018
Filing Date:
June 18, 2014
Export Citation:
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Assignee:
Asahi Organic Material Co., Ltd.
International Classes:
B22C1/22; B22C9/12
Domestic Patent References:
JP2010264463A
JP2013244502A
JP2008055468A
JP2014065048A
JP2012076113A
JP2012115870A
Foreign References:
WO2011030795A1
US20080060778
Attorney, Agent or Firm:
Michio Nakajima
Masahiro Nakashima



 
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