Title:
PROCESSING DEVICE AND PROCESSING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2019042899
Kind Code:
A
Abstract:
To provide a processing device that can perform both cutting processing and honing processing alone, is small-sized and does not require a complicated structure.SOLUTION: The processing device, in which a cutting processing unit 6 having a cutting grindstone 65 and a honing processing unit 7 having a honing grindstone 75 are provided in parallel, comprises a tool table 41 that can move in a Z-direction, and further comprises a work table 52 that supports a work-piece W rotatably and feeds the work-piece W in an X-direction so that the work-piece is positioned at a cutting processing position and at a honing processing position. After rotating the work-piece W and the cutting grindstone 65 to subject the work-piece to the cutting processing, the work-piece W is fed to the honing processing position and then subjected to honing processing by rotating the work-piece W and enlarging the diameter of the honing grindstone 75 while oscillating the grindstone.SELECTED DRAWING: Figure 1
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Inventors:
AOKI SEIJI
KOURA NAOKI
KOURA NAOKI
Application Number:
JP2017171043A
Publication Date:
March 22, 2019
Filing Date:
September 06, 2017
Export Citation:
Assignee:
TOYO ADVANCED TECH CO LTD
International Classes:
B24B51/00; B24B5/06; B24B33/02; B24B41/04
Attorney, Agent or Firm:
Maeda patent office