Title:
PROCESSING DEVICE AND PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2017135297
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a processing device and a processing method capable of forming the conductor pattern of a printed wiring board to be manufactured properly without causing cost increase.SOLUTION: A processing device for manufacturing a printed wiring board by cutting the copper foil of a copper clad laminate placed on a table substantially in parallel with the XY plane, by means of a processing tool held on a main shaft, has electrification means for electrifying the copper foil, sensing means for sensing electrification when the processing tool held on the main shaft comes into contact with the electrified copper foil, detection means for detecting the Z coordinate value when the sensing means senses electrification at at least three preset sensing positions on the copper foil surface, correction means for correcting the processing data so that a conductor pattern is formed on a plane including all detection points, i.e., the points represented by the Z coordinate value sensed by the sensing means at the detection points, and control means for controlling to cut the copper foil based on the processing data corrected by the correction means.SELECTED DRAWING: Figure 2
Inventors:
MIYAMOTO KAZUTO
Application Number:
JP2016015005A
Publication Date:
August 03, 2017
Filing Date:
January 29, 2016
Export Citation:
Assignee:
ROLAND DG CORP
International Classes:
H05K3/04; B23Q15/26; G05B19/404
Domestic Patent References:
| JPH0794846A | 1995-04-07 | |||
| JPH08130379A | 1996-05-21 | |||
| JPH10111706A | 1998-04-28 | |||
| JP2015070221A | 2015-04-13 | |||
| JPH0519824A | 1993-01-29 |
Attorney, Agent or Firm:
Junichi Ueshima