Title:
加工装置
Document Type and Number:
Japanese Patent JP7358560
Kind Code:
B2
Abstract:
To provide a processing device capable of being installed in a space-saving manner, and continuously performing grinding of wafers with a simple structure.SOLUTION: A processing device includes: a plurality of zippers 22 absorbing and holding wafers; an index table 21 arranged with the plurality of zippers 22 on a concentric circle, and conveying the zippers 22 between rough-grinding means, middle-grinding means and precise-grinding means; and a tilt mechanism for inclining the rotation axis of the zipper 22. A perpendicular L2 to a tilt shaft L1 of the tilt mechanism, passing the rotation center of the zipper 22 in a plane view is set to pass the rotation center of the index table 21.SELECTED DRAWING: Figure 8
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Inventors:
Makoto Shimoda
Application Number:
JP2022086602A
Publication Date:
October 10, 2023
Filing Date:
May 27, 2022
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B7/04; B24B7/00; B24B41/06; H01L21/304
Domestic Patent References:
| JP2019155525A | ||||
| JP6283081B1 | ||||
| JP2002200545A | ||||
| JP2008264913A |
Attorney, Agent or Firm:
Takamitsu Shimizu