Title:
加工装置
Document Type and Number:
Japanese Patent JP7454920
Kind Code:
B2
Abstract:
To provide a processing device to which a cutting blade is attached, which enables a distance between spindles to be shortened without requiring troublesome work.SOLUTION: A processing device 100 comprises a spindle housing 11, a mount, a cutting blade 14, and a blade cover 15. The mount includes a columnar boss part extending in a longitudinal direction, and a support surface that protrudes outward in a radial direction from behind the boss part to support the cutting blade 14. The cutting blade 14 has, at a center, an insertion hole 14-3 that is inserted into the boss part. The blade cover 15 comprises an opposing part 15-2 opposing to a surface 24-2 side of the cutting blade 14 with a rear surface side of the cutting blade 14 attached to the mount. Homopolar magnetic fields are applied to the opposing part 15-2 and the surface 24-2 of the cutting blade 14, and the cutting blade 14 is pressed against the mount by force of repulsion to be held.SELECTED DRAWING: Figure 3
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Inventors:
Omae scroll
Application Number:
JP2019128684A
Publication Date:
March 25, 2024
Filing Date:
July 10, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B27/06; B23Q11/00; B23Q11/08; B24B45/00; B24B55/04; H01L21/301
Domestic Patent References:
| JP2015160273A | ||||
| JP2013086189A | ||||
| JP2013146797A |
Foreign References:
| US5447086 |
Attorney, Agent or Firm:
Sakai International Patent Office