Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2017195219
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To appropriately align a wafer even when a ring-like reinforcement is removed from the wafer in which the ring-like reinforcement part is formed at an outer peripheral side.SOLUTION: A wafer processing method for removing a ring-like reinforcement part from a wafer (W) in which the ring-like reinforcement part (71) is formed around a device area (A1), comprises: the step of supporting the wafer on a frame (F) via a hold tape (T); the step of forming a mark (M) corresponding to a notch (N) at an inner diameter side from a bounder (73) between the ring-like reinforcement part and the device area; the step of separating the device area and the ring-like reinforcement part by cutting the boundary between the ring-like reinforcement part and the device area together with a hold tape; and the step of removing the ring-like reinforcement part by separating the ring-like reinforcement part from a hold table together with the frame.SELECTED DRAWING: Figure 4
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Inventors:
TSUCHIYA TOSHIO
HOSHINO HITOSHI
HOSHINO HITOSHI
Application Number:
JP2016082781A
Publication Date:
October 26, 2017
Filing Date:
April 18, 2016
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/304; B23K26/00; B23K26/351; H01L21/68; H01L21/683
Domestic Patent References:
| JP2015213955A | 2015-12-03 | |||
| JP2015195314A | 2015-11-05 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki
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