Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019186489
Kind Code:
A
Abstract:
To provide a wafer processing method that does not leave an adhesive layer on a wafer surface even when a protective tape is applied to the wafer surface and the back surface is ground.SOLUTION: A wafer processing method for grinding the back surface of a wafer having a plurality of devices formed on the surface includes at least a polyester sheet laying step of laying a polyester sheet on the surface of the wafer, an integration step of heating and thermocompression-bonding at least the polyester sheet to integrate the wafer and the polyester sheet, a back surface grinding step of holding the polyester sheet on a chuck table and grinding the back surface of the wafer, and a peeling step of peeling the polyester sheet from the surface of the wafer.SELECTED DRAWING: Figure 2
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Inventors:
KITAMURA HIROSHI
Application Number:
JP2018078677A
Publication Date:
October 24, 2019
Filing Date:
April 16, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B24B7/22; B24B7/24; B24B41/06; H01L21/304
Domestic Patent References:
| JP2010073816A | 2010-04-02 | |||
| JP2005191296A | 2005-07-14 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko