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Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019212811
Kind Code:
A
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed in each region on a surface partitioned by division schedule lines into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a dividing step, and a picking-up step. The polyester-based sheet arranging step positions the wafer in an opening of a frame and arranges a polyester-based sheet in a rear surface of the wafer and an outer periphery of the frame, the opening housing the wafer. The integrating step heats the polyester-based sheet by applying hot air to the sheet and integrates the wafer and the frame via the polyester-based sheet. The dividing step divides the wafer into individual device chips by cutting the wafer along division schedule lines using a cutting device rotatably including a cutting blade. The picking-up step pushes up the device chip by spraying air and picks up the device chip from the polyester-based sheet.SELECTED DRAWING: Figure 4

Inventors:
HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
Application Number:
JP2018108956A
Publication Date:
December 12, 2019
Filing Date:
June 06, 2018
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; B24B41/06; H01L21/683
Domestic Patent References:
JPH09266183A1997-10-07
JP2012054582A2012-03-15
JPH10112494A1998-04-28
JPH0254564A1990-02-23
JP2003188195A2003-07-04
JP2009105249A2009-05-14
JP2006335860A2006-12-14
Foreign References:
WO2016151911A12016-09-29
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro



 
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