Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019212818
Kind Code:
A
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface into individual device chips comprises a polyester-based sheet arranging step, an integrating step, a frame supporting step, a dividing step, and a picking-up step. The polyester-based sheet arranging step arranges a polyester-based sheet on a rear surface of the wafer. The integrating step heats and presses the polyester-based sheet, and integrates the wafer and the polyester-based sheet. The frame supporting step supports the polyester-based sheet by a frame composed of a first frame including an opening and a plurality of magnets and a second frame including an opening by holding an outer periphery of the polyester-based sheet between the first frame and the second frame by a magnetic force using the frame. The dividing step divides the wafer into individual device chips by cutting the wafer using a cutting device. The picking-up step pushes up the device chip by spraying air.SELECTED DRAWING: Figure 4
Inventors:
HARADA SHIGENORI
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
MATSUZAWA MINORU
KIUCHI ITSUTO
YODO YOSHIAKI
ARAKAWA TARO
UENO MASAMITSU
KAWAMURA SUMIKO
FUJII YUSUKE
MIYAI TOSHITERU
OMAE MAKIKO
Application Number:
JP2018108963A
Publication Date:
December 12, 2019
Filing Date:
June 06, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; B24B41/06; H01L21/683
Domestic Patent References:
| JP2007165636A | 2007-06-28 | |||
| JP2003100727A | 2003-04-04 | |||
| JPH0637169A | 1994-02-10 | |||
| JP2000138277A | 2000-05-16 | |||
| JPH10112494A | 1998-04-28 | |||
| JP2005191297A | 2005-07-14 | |||
| JP2007250598A | 2007-09-27 | |||
| JP2005302932A | 2005-10-27 | |||
| JP2014049452A | 2014-03-17 |
Foreign References:
| WO2018003312A1 | 2018-01-04 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro
Tomohiro Okamoto
Kasahara Takahiro