Title:
Wafer processing method
Document Type and Number:
Japanese Patent JP6325279
Kind Code:
B2
Abstract:
A wafer processing method includes a cut groove forming step of positioning, from a back side of the substrate, a cutting blade to an area corresponding to a division line to form cut grooves in such a manner that the cutting blade does not reach a functional layer and part of a substrate is left, and a functional layer cutting step of performing irradiation with a laser beam along the division lines formed in the functional layer forming a wafer to perform ablation processing for the functional layer and cut the functional layer. In the cut groove forming step, the cut grooves are formed along the division lines in such a manner that an uncut part is left in a peripheral area of the wafer.
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Inventors:
Yoshiaki Yodo
Application Number:
JP2014032293A
Publication Date:
May 16, 2018
Filing Date:
February 21, 2014
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/38
Domestic Patent References:
| JP201016361A | ||||
| JP2013175642A | ||||
| JP6224298A | ||||
| JP8213347A | ||||
| JP91542A | ||||
| JP200988252A |
Attorney, Agent or Firm:
Hiroaki Sakai
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