Title:
ＰＣＢ汚染フィルム素子の処理装置及び方法
Document Type and Number:
Japanese Patent JP5797098
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and a method for treating PCB contaminated film element capable of preventing deterioration of working environment in a storage facility when a PCB contaminated film element is stored after cleaning.SOLUTION: The apparatus for treating PCB contaminated film element includes: a PCB removal cleaning apparatus 13 for cleaning the fragmented (grinding, cutting, or the like) PCB contaminated film element 11 using a PCB removal cleaning solvent (IPA, NS100, hexane, or the like); a graduation determining apparatus 17 for determining the residual PCB concentration in the PCB removed film element 14A after cleaning using the PCB removal cleaning apparatus 13; a dissolving apparatus 20 for dissolving and melting the determination-passed PCB removed film element 14A using a dissolving solvent 24; and a distillation separation device 27 for distilling the film element dissolved substance 25 to recover the solvent.
Inventors:
Chiyuki Tsukahara
Ryuichiro Tanaka
Koji Oura
Ryuichiro Tanaka
Koji Oura
Application Number:
JP2011253259A
Publication Date:
October 21, 2015
Filing Date:
November 18, 2011
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
C08J11/08
Domestic Patent References:
| JP2003236492A | ||||
| JP2003279542A | ||||
| JP2000309662A | ||||
| JP2013094728A | ||||
| JP2003094013A | ||||
| JP2005152714A | ||||
| JP2007244969A | ||||
| JP2006334572A | ||||
| JP58065625A | ||||
| JP2006274101A | ||||
| JP2000290426A | ||||
| JP5017616A |
Foreign References:
| WO1994006854A1 | ||||
| US20080103347 |
Attorney, Agent or Firm:
Hiroaki Sakai
Jun Takamura
Jun Takamura