Title:
反応性多層接合によるコンプライアント要素によって圧力を制御するための方法と装置、及びこの方法に従って接合された製品
Document Type and Number:
Japanese Patent JP2007511369
Kind Code:
A
Abstract:
The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pressure on the two components in contact with the reactive multilayer foil via a compliant element, and initiating a chemical transformation of the reactive multilayer foil so as to physically join the at least two components. The invention also includes two components joined using the aforementioned method.
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Inventors:
Van, haerden, david
Jessie Newson
Rood, Timothy
Kunio, Omar, M.
Weiss, Timothy, Pea.
Jessie Newson
Rood, Timothy
Kunio, Omar, M.
Weiss, Timothy, Pea.
Application Number:
JP2006538440A
Publication Date:
May 10, 2007
Filing Date:
November 03, 2004
Export Citation:
Assignee:
Reactive Nanotechnology, Inc.
International Classes:
B23K28/00; B23K1/00; B23K1/19; B23K3/04; B23K3/08; B23K35/00; B23K35/02; B23K35/12; B23K35/34; B32B15/01; C06B45/14
Attorney, Agent or Firm:
Yoshiyuki Inaba
Shinji Oga
Toshifumi Onuki
Shinji Oga
Toshifumi Onuki