Title:
【発明の名称】埋込み電子装置を有する製品とその製作方法
Document Type and Number:
Japanese Patent JP2003524811
Kind Code:
A
Abstract:
A method for making an article having an electronic device embedded therein comprises providing a substrate having first and second opposing broad planar surfaces; mounting an electronic device on the first broad planar surface of the substrate; and applying a layer of melt-flowable adhesive of substantially uniform thickness on the first broad planar surface of the substrate to cover the electronic device. The article produced thereby has the electronic device encapsulated by the layer of melt-flowable adhesive.
Inventors:
Chang, Kevin, Won Thai
Application Number:
JP2000576685A
Publication Date:
August 19, 2003
Filing Date:
October 14, 1999
Export Citation:
Assignee:
Amerasia International Technology, Inc.
International Classes:
B42D15/10; B32B3/08; B32B7/12; B32B33/00; B32B37/20; G06K19/077; H01L23/055; H01L23/498; H01L23/538; H01Q1/22; H01Q1/36; H01Q1/38; H01Q7/00; H01Q23/00; H05K1/11; H05K3/40; H05K1/00; H05K1/16; H05K3/42; (IPC1-7): G06K19/077; B42D15/10
Attorney, Agent or Firm:
Kazuo Takeshita