Title:
【発明の名称】電子部品の製造方法
Document Type and Number:
Japanese Patent JP2594142
Kind Code:
B2
Abstract:
A process for producing an electronic part which comprises: coating a predetermined surface of the electronic part with a composition comprising as basic ingredients 100 parts by weight of a polyorganosiloxane having an alkenyl group, 0.01 to 10 parts by weight of an organic peroxide and 0.01 to 20 parts by weight of an adhesion promoter, thereby to form a layer of the composition adhered to the predetermined surface of the electronic part; subjecting said electronic part having adhered thereto the composition layer to heat treatment, thereby to convert said composition layer into a layer of a cured elastomer having surface tackiness; and forming a protective sealing resin layer on the cured elastomer layer having surface tackiness.
Inventors:
Matsumoto Yasushi
Shinya Goyama
Yasushi Kuwahara
Shinya Goyama
Yasushi Kuwahara
Application Number:
JP30270388A
Publication Date:
March 26, 1997
Filing Date:
November 30, 1988
Export Citation:
Assignee:
Toshiba Silicone Co., Ltd.
International Classes:
H01L21/56; C08L83/05; C08L83/07; H01L23/29; H05K5/00; (IPC1-7): H01L21/56; C08L83/05; C08L83/07
Domestic Patent References:
| JP5328471B1 | ||||
| JP5826376B2 | ||||
| JP5313508B2 |
Attorney, Agent or Firm:
Saichi Suyama (1 person outside)