Title:
選択された電気的性質をもつ高周波基板の製造方法
Document Type and Number:
Japanese Patent JP2007509591
Kind Code:
A
Abstract:
Method for fabricating a textured dielectric substrate ( 400 ) for an RF circuit. The method can include the step ( 104 ) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter ( 106 ) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials ( 202, 204 ) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces ( 206, 208 ). Arranging the dielectric pieces on a base plate ( 302 ) in accordance with the selected pattern to form the textured dielectric substrate.
Inventors:
Thebes, Dennis, El
Smith, thomas, pea
Provo, Terry
Ruggero, Dara
Smith, thomas, pea
Provo, Terry
Ruggero, Dara
Application Number:
JP2006538073A
Publication Date:
April 12, 2007
Filing Date:
October 18, 2004
Export Citation:
Assignee:
Harris Corporation
International Classes:
H01P11/00; C03B29/00; H01Q17/00; H05K1/02; H05K3/12; H05K1/03; H05K3/00
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Shinsuke Onuki
Tadashige Ito