Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2984383
Kind Code:
B2
Inventors:
HASHIMOTO TAKESHI
Application Number:
JP1985691A
Publication Date:
November 29, 1999
Filing Date:
February 13, 1991
Export Citation:
Assignee:
KAWASAKI SEITETSU KK
International Classes:
H01L21/3205; H01L21/768; (IPC1-7): H01L21/3205
Domestic Patent References:
| JP61295643A |
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)