Title:
固体撮像素子の製造方法
Document Type and Number:
Japanese Patent JP4174247
Kind Code:
B2
Abstract:
To provide a method of manufacturing solid-state imaging device which can be reduced in size and manufactured easily with higher reliability.
The solid-state imaging device comprises a semiconductor substrate 101 which is completed by forming a solid-state imaging element and a translucent member 220 which is connected to the semiconductor substrate to have a gap opposing to the light receiving region of the solid-state imaging element. The translucent member forms an optical member having the light condensing function.
COPYRIGHT: (C)2004,JPO
Inventors:
Hiroshi Maeda
Kazuhiro Nishida
Negishi Nohisa
Shunichi Hosaka
Kazuhiro Nishida
Negishi Nohisa
Shunichi Hosaka
Application Number:
JP2002183072A
Publication Date:
October 29, 2008
Filing Date:
June 24, 2002
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G02B3/00; H01L27/14; H04N5/335
Domestic Patent References:
| JP2001351997A | ||||
| JP7202152A | ||||
| JP6113214A | ||||
| JP2002329850A |
Attorney, Agent or Firm:
Takeshi Takamatsu
Kiyozumi Yazawa
Kiyozumi Yazawa