Title:
回路付サスペンション基板の製造方法
Document Type and Number:
Japanese Patent JP4187687
Kind Code:
B2
Abstract:
A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4 . Then, a conductive pattern 7 is formed on the thin metal film 5 . Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4 . Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2 . Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8 , feeding electric power from the conductive pattern 7 , and a metal filling layer 14 is formed in the metal board opening portion 11 , to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.
Inventors:
Aonuma Hidenori
Yasuto Owaki
Yasuto Owaki
Application Number:
JP2004183435A
Publication Date:
November 26, 2008
Filing Date:
June 22, 2004
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
G11B5/60; G03C5/00; G11B21/21; H05K1/03; H05K3/44; H05K1/05; H05K3/06; H05K3/10; H05K3/24
Domestic Patent References:
| JP2001352137A | ||||
| JP8111015A | ||||
| JP2001339967A | ||||
| JP7231169A |
Attorney, Agent or Firm:
Hiroyuki Okamoto