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Title:
剛直に結合された薄い砥石の製造方法
Document Type and Number:
Japanese Patent JP4157082
Kind Code:
B2
Abstract:
A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered metal bond including a stiffness enhancing metal component exhibits superior stiffness. The metals can be selected from among many sinterable metal compositions. Blends of nickel and tin are preferred. The stiffness enhancing metal is a metal capable of providing substantially increased rigidity to the bond without significantly increasing bond hardness. Molybdenum, rhenium, tungsten and blends of these are favored. The sintered bond is generally formed from powders. A diamond abrasive, nickel/tin/molybdenum sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.

Inventors:
Ramanas, Srinivasan
Andrews, Richard M.
Application Number:
JP2004243437A
Publication Date:
September 24, 2008
Filing Date:
August 24, 2004
Export Citation:
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Assignee:
Saint-Gobain Abrasives, Incorporated
International Classes:
B24D3/00; B24D3/06; B24D3/34; B24D5/02; B24D5/12; B28D5/02; C22C26/00; H01L21/304
Domestic Patent References:
JP54082787A
JP51033315B2
JP10230464A
JP58217271A
JP51000752B1
JP6091538A
JP60099568A
JP50065990A
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Masatoshi Iwade
Masaya Nishiyama
Higuchi Souji