Title:
レチクルの製造方法
Document Type and Number:
Japanese Patent JP4409362
Kind Code:
B2
Abstract:
A reticle manufacturing method comprises a step of retreating side surfaces of a lift-off pattern to reduce an area of a wide pattern portion, a step of forming a wide convex pattern and a narrow convex pattern by etching a glass substrate (transparent substrate) while using a second mask pattern as a mask, a step of reducing an area of a first wide mask portion, a step of reducing at least an area of a second wide mask portion smaller than an area of the first wide mask portion, and a step of reducing an area of a wide light shielding portion by etching the wide light shielding portion while using the first wide mask portion as a mask.
Inventors:
Hisashi Shirai
Kiyoshi Ozawa
Kiyoshi Ozawa
Application Number:
JP2004160135A
Publication Date:
February 03, 2010
Filing Date:
May 28, 2004
Export Citation:
Assignee:
Fujitsu Microelectronics Limited
International Classes:
G03C5/00; G03F1/68; G03F1/76; G03F7/20; H01L21/027; H01L21/302; H01L21/76
Domestic Patent References:
| JP10207036A | ||||
| JP9101616A | ||||
| JP7325382A | ||||
| JP5313344A | ||||
| JP4013140A | ||||
| JP7225467A | ||||
| JP6083024A |
Foreign References:
| WO2003042629A1 | ||||
| US5358807 |
Attorney, Agent or Firm:
Keizo Okamoto