Title:
有機回路の作製プロセス
Document Type and Number:
Japanese Patent JP4700162
Kind Code:
B2
Abstract:
An organic semiconductor film is fabricated by applying a solution containing an organic semiconductor material and a solvent to a substrate, e.g., by solution casting, and evaporating the solvent. The characteristics of the substrate surface, the organic semiconductor material, and the process parameters are selected to provide desirable nucleation and crystal growth. The resultant organic semiconductor film contains a large area, e.g., a continuous area greater than 1 cm<2>, that exhibits a relatively high charge carrier mobility of at least about 10<-4> cm<2>V<-1>s<-1> at room temperature.
Inventors:
Howard Edan Katz
Wensey lee
Wensey lee
Application Number:
JP2000090010A
Publication Date:
June 15, 2011
Filing Date:
March 29, 2000
Export Citation:
Assignee:
Alcatel-Lucent USA Inc.
International Classes:
H01L21/368; H01L29/786; H01L51/00; H01L51/05; H01L51/30; H01L51/40
Domestic Patent References:
| JP9245625A | ||||
| JP7221367A |
Foreign References:
| WO1999012989A1 |
Other References:
H.Akimichi et al,Applied Physics Letters,1991年4月8日,vol.58,no.4,pp.1500-1502
J.C.Wittmann et al,Thin Solid Films,1997年,vol.303,pp.207-212
J.C.Wittmann et al,Thin Solid Films,1997年,vol.303,pp.207-212
Attorney, Agent or Firm:
Okabe
Masao Okabe
Nobuaki Kato
Shinichi Usui
Takao Ochi
Asahi Shinmitsu
Masao Okabe
Nobuaki Kato
Shinichi Usui
Takao Ochi
Asahi Shinmitsu