Title:
WAFER DRAWING APPARATUS
Document Type and Number:
Japanese Patent JP2500006
Kind Code:
B2
Abstract:
PURPOSE: To facilitate sampling of inspection wafers.
CONSTITUTION: A wafer feed mechanism 3 houses a wafer 1 on a predetermined shelf of casette 4. Upon receiving an inspection command, the wafer feed mechanism 3 houses an inspection wafer in a tray 5. After inspection, the wafer is set again in the stay 5 and the wafer feed mechanism 3 receives the wafer from the tray 5 and houses the wafer on a predetermined shelf of the casette 4.
Inventors:
MIZUMURA TSUTOMU
Application Number:
JP17998195A
Publication Date:
May 29, 1996
Filing Date:
July 17, 1995
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
H01L21/66; G01R31/26; H01L21/677; H01L21/68; (IPC1-7): H01L21/66; G01R31/26; H01L21/68
Domestic Patent References:
| JPS59139642A | ||||
| JPS60239036A |
Attorney, Agent or Firm:
Kenzo Matsuura