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Title:
FOAM-MOLDED MATERIAL OF SYNTHETIC RESIN
Document Type and Number:
Japanese Patent JPH0592490
Kind Code:
A
Abstract:

PURPOSE: To obtain a foam-molded material of synthetic resin which keeps off a harmful insect, such as a tick, by a method wherein a mica is incorporated in or bonded to the molded material.

CONSTITUTION: It is preferable for incorporating a mica in a foam-molded material of a synthetic resin that fine powder of mica is mixed in the synthetic resin. It is preferable for bonding a mica to the molded material that a dispersion of mica in a suitable solvent is applied and dried on the material. As the coating method, a dipping method, a spraying method, a brushing method, and the like can be used. At this time, as the synthetic resin, resins which can be foam-molded can be used without a particular limit. For example, a polystyrene resin, a polyurethane resin can be used. In addition, as the mica, a phlogopite, a muscovite, and the like are preferably used. These are used singly or in combination.


Inventors:
ISSHIKI TADAO
Application Number:
JP16200991A
Publication Date:
April 16, 1993
Filing Date:
June 05, 1991
Export Citation:
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Assignee:
ISSHIKI TADAO
International Classes:
B29C44/00; B68G5/02; B29K105/04; B29K105/16; B29L31/10; B29L31/44; (IPC1-7): B29C67/22; B29K105/04; B29K105/16; B29L31/10; B29L31/44; B68G5/02
Domestic Patent References:
JPS6295330A1987-05-01
JPS58136630A1983-08-13
Attorney, Agent or Firm:
Kenji Itami



 
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