Title:
ポンプ装置及びそのポンプユニット
Document Type and Number:
Japanese Patent JP4644189
Kind Code:
B2
Abstract:
A pump apparatus comprises a low-temperature flat plate group (a low-temperature portion) C having flat plates 5 as a plurality of low-temperature bodies arranged parallel with each other with intervals in a direction crossing a passage 4 of gas, a high-temperature flat plate group (a high-temperature portion) H having flat plates 6 as a plurality of high-temperature bodies arranged parallel with each other with intervals in the direction crossing the passage 4, and temperature operation means for operating at least one of temperatures of the flat plate groups to generate temperature difference between the flat plate groups. The flat plates 5 and the flat plates 6 are displaced from each other in a flow direction in the passage 4, and a heat insulating layer interposed between the flat plates 5 and the flat plates 6.
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Inventors:
Hiroshi Sugimoto
Yoshio Sone
Tetsuro Obayashi
Yoshio Sone
Tetsuro Obayashi
Application Number:
JP2006511298A
Publication Date:
March 02, 2011
Filing Date:
March 23, 2005
Export Citation:
Assignee:
Osaka Vacuum Equipment Co., Ltd.
International Classes:
F04B37/06; F04B19/00; F04B19/24; F04D33/00
Domestic Patent References:
| JPS61169680A | 1986-07-31 |
Attorney, Agent or Firm:
Koji Yamamoto