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Patent Searching and Data


Title:
A quality and efficient spring grinding method
Document Type and Number:
Japanese Patent JP6214774
Kind Code:
B2
Abstract:
Disclosed is a method for grinding a spring with high quality and high efficiency, comprising the steps as follows: firstly, at least one of an upper grinding wheel (1) and a lower grinding wheel (2) is configured to comprise an inner grinding wheel (21) and an outer grinding wheel (24), wherein the inner grinding wheel (21) is fitted in the outer grinding wheel (24); the inner grinding wheel (21) or the outer grinding wheel (24) is driven by a transmission mechanism, the inner grinding wheel (21) and the outer grinding wheel (24) rotating in opposite directions; after a complete spring is fed to a space between the upper grinding wheel (1) and the lower grinding wheel (2), the complete spring is moved back and forth in the plane of the grinding wheels; and then the upper grinding wheel (1) is moved downwardly such that two end faces of the spring are ground by the grinding wheels, and when the height of the ground spring meets the requirement, the upper grinding wheel (1) is stopped moving downwardly and is returned to the original point later. Then, the ground spring movement is stopped and it is moved away from the space between the two grinding wheels, i.e., the complete spring is removed. In this way, the spring is ground in a revolving state, which can improve the yield and quality of ground springs, save energy and protect the environment, and result in a low cost of grinding, a simple structure, low cost for manufacturing parts, long persistence in precision of mechanisms, and good stability.

Inventors:
Yue Lin
Resolution
Yellow flower
Application Number:
JP2016543031A
Publication Date:
October 18, 2017
Filing Date:
May 22, 2014
Export Citation:
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Assignee:
Zhejiang Home Degree Machinery Co., Ltd.
International Classes:
B24B7/17; B24B7/16; B24B41/06
Domestic Patent References:
JP48009496U
JP48102679U
JP62127752U
JP60042552U
JP2009279709A
JP1310852A
Foreign References:
US1763820
Attorney, Agent or Firm:
sk patent corporation
Akihiko Okuno
Hiroyuki Ito