Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2017181696
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in sensitivity, LWR performance, and film thickness reduction-preventing properties.SOLUTION: This invention relates to a radiation-sensitive resin composition, comprising: a first polymer that has a carbon atom constituting a ring structure in a main chain, and has an aromatic ring and an acid-dissociable group in a side chain; and a radiation-sensitive acid generator. Preferably, the first polymer has a structural unit expressed by the following formula (1-1), (1-2), or (1-3). In the following formula, the ring structure represents: an alicyclic ring structure with a 4- to 20-membered ring, which has an aromatic ring and an acid-dissociable group; or an aliphatic heterocyclic structure with a 4- to 20-membered ring, which has an aromatic ring and an acid-dissociable group.SELECTED DRAWING: None
Inventors:
MIYATA HIROMU
Application Number:
JP2016066902A
Publication Date:
October 05, 2017
Filing Date:
March 29, 2016
Export Citation:
Assignee:
JSR CORP
International Classes:
G03F7/039; C08F22/40; C08F24/00; C08F32/04; G03F7/004; G03F7/20
Domestic Patent References:
JP2013080004A | 2013-05-02 | |||
JP2006091578A | 2006-04-06 |
Foreign References:
US20130171561A1 | 2013-07-04 |
Attorney, Agent or Firm:
Hajime Amano
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka
Yoshinori Ikeda
Hiroshi Ogawa
Koji Ishida
Kazuki Kagami
Kenichi Fujinaka
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