Title:
The radiographic inspection method and a device
Document Type and Number:
Japanese Patent JP6258845
Kind Code:
B2
Abstract:
A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.
Inventors:
Toshiyuki Nakao
Yuta Urano
Zhang Kaifeng
Hideaki Sasazawa
Yuta Urano
Zhang Kaifeng
Hideaki Sasazawa
Application Number:
JP2014257691A
Publication Date:
January 10, 2018
Filing Date:
December 19, 2014
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
G01N23/04; G01B15/00; G01B15/08; G01N23/083
Domestic Patent References:
| JP200985923A | ||||
| JP2013130392A | ||||
| JP2009174972A |
Foreign References:
| US20030095631 |
Attorney, Agent or Firm:
Aoritsu patent business corporation